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Heat Transfer at Solid-Liquid Interfaces

The past few decades have seen a rapid growth in the computational power of processor chips. The exponential increase in transistor density and storage density as well as the faster clock speed, however, cause serious problems in the thermal management of microelectronic devices, making efficient heat dissipation perhaps the most crucial challenge that limits the development of microelectronic device technologies. Although liquid cooling was proposed and seems to be promising that could be an alternative method for cooling the next generation of microchips, particularly in compact multichip modules and 3D microelectronic packages, thermal resistances at solid-liquid interfaces still dominate and limit the efficient heat dissipation in such system.

Our goal is to, using molecular modeling, better understand heat transfer between solid-liquid interfaces involved in liquid cooling system, provide nanoscale images at atomic and even electronic resolution, predict the nanoscale interaction of different materials, and thus evaluate strategies for designing molecules and material structures for nanotechnological uses.

Project Related Publications

 

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© 2014 ETH Zurich | Imprint | Disclaimer | 10 January 2012
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